Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package
ISBN-10
1119793777
ISBN-13
9781119793779
Category
Technology & Engineering
Pages
272
Language
English
Published
2022-02-15
Publisher
John Wiley & Sons
Authors
Beth Keser, Steffen Kröhnert

Description

This book provides an in-depth understanding of the various fan-out and embedded die approaches given by authors offering differing perspectives. It begins by benchmarking the latest application space, then moves on to a market forecast that attempts to reverse engineer the products that will be available. The book also provides an analysis of the IP landscape and cost comparison of new and existing technologies. It then describes solutions developed and offered by Semiconductor IDM companies driving new package types for advanced application space (e.g. Intel, NXP, Samsung). The book addresses the semiconductor needs of various foundries and manufacturers, and concludes by exploring cutting edge research ongoing at institutes and consortiums.

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