Integrated Interconnect Technologies for 3D Nanoelectronic Systems

ISBN-10: 1596932473
ISBN-13: 9781596932470
Category: Technology & Engineering
Pages: 528
Language: English
Published: 2008-11-30
Publisher: Artech House
Authors: Muhannad S. Bakir, James D. Meindl

Description

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.

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