The book is important because it reflects a trend, especially in microelectronics manufacture toward recyclability. Europe and Asia are moving towards legislation to ban the use of lead in solders and public demand in the US will likely have the same result. Producers of solders and manufacturers who use them will have to invent and employ suitable substitutes and A Guide to Lead-free Solders will show them how to do so.
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J. Liang, D. Shangguan, and S. Downes, Effects of Load and Thermal Conditions on Lead-Free Solder Joint Reliability, ... Solder Joints Under Dynamic Mechanical Loading, International Journal of Microcircuits and Electronic Packaging, ...
S. Ganesan, M. Pecht, Lead-free electronics, CALCE EPSC Press, 2003. Y. Kariya, and M. Otsuka, Effect of Bismuth on the Isothermal Fatigue Properties of Sn-3.5 mass% Ag Alloy, Journal of Electronic Materials, Volume 27, Issue 7, ...
1996. pp. 252–5. Tojima K. Wetting characteristics of lead-free solders, senior project report. Materials Engineering Department, San Jose State University, May 1999. Hua F, Glazer J. Lead-free solders for electronic assembly, ...
Prepared by the NEMI Task Group on Lead-Free Alloys and Reliability. Documents standardized test procedures that can produce valid and reproducible mechanical-property data for lead-free solders.
It is hope that this book provides wider awareness of the current status of lead-free electronic solders.
This is a comprehensive guide to current methods of soldering components to their substrates, written by one of the founding fathers of the technology.
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