3D Microelectronic Packaging: From Architectures to Applications

3D Microelectronic Packaging: From Architectures to Applications
ISBN-10
9811570906
ISBN-13
9789811570902
Category
Technology & Engineering
Pages
622
Language
English
Published
2020-11-23
Publisher
Springer Nature
Authors
Yan Li, Deepak Goyal

Description

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

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