Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
Michael Pecht, Riko Radojcic, Gopal Rao. for extensive research and development . Line or interconnect metallization has been studied for a long time . A wide variety of conductor materials are available for metal interconnects that use ...
Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.
The Electronic Packaging Series Series Editor: Michael G. Pecht, University of Maryland Advanced Routing of Electronic Modules Michael Pecht and Yeun Tsun Wong Electronic Packaging Materials and Their Properties Michael Pecht, ...