Chip Scale Package (CSP): Design, Materials, Processes, and Applications

ISBN-10
0071165088
ISBN-13
9780071165082
Category
Integrated circuits
Pages
564
Language
English
Published
1999
Authors
John H. Lau, Shi-Wei Ricky Lee

Description

The first comprehensive, in-depth guide to chip scale packaging (CSP), this reference gives you cutting-edge information on the most important new development in electronic packaging since surface mount technology (SMT).

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