Area Array Packaging Handbook: Manufacturing and Assembly
- ISBN-10
- 0071374930
- ISBN-13
- 9780071374934
- Category
- Technology & Engineering / Electronics / Microelectronics
- Pages
- 1000
- Language
- English
- Published
- 2002
- Publisher
- Mcgraw-hill
- Author
- Ken Gilleo
Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
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Other editions
-
- 2001-11-26
- 1000 pages
- Ebook
- McGraw Hill Professional
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