Microelectronic Failure Analysis: Desk Reference
- ISBN-10
- 0871706385
- ISBN-13
- 9780871706386
- Category
- Technology & Engineering / Reference
- Pages
- 643
- Language
- English
- Published
- 1999
- Publisher
- ASM International
- Authors
- Richard J. Ross, Christian Boit, Donald Staab
Description
Forty-seven papers on electronics failure analysis provide an overview for newcomers to the field and a reference tool for the experienced analyst. Topics include electron/ion bean-based techniques, deprocessing and sample preparation, and physical/chemical defect characterization. For the fourth ed
Get the book
Other editions
-
- 2002-01-01
- 160 pages
- Paperback
- ASM International
Similar books
-
Microelectronics Failure Analysis: Desk Reference
Chip Scale Package (CSP) is ideal for the applications of Cellular and Portable devices that require better use of real estate on the PC boards. It has advantages of low package profile, easy routing and superior reliability.
-
Microelectronics Fialure Analysis Desk Reference, Seventh Edition
By Tejinder GandhiThe adoption of Chip Scale Packages (CSPs) has been one of the most significant and successful trends in the electronics industry since their introduction in the early 90s. CSPs are well accepted by the electronic industry due to their ...
-
Microelectronic Failure Analysis Desk Reference: 2001 Suppplement
Developed by the Electronic Device Failure Analysis Society (EDFAS) Publications Committee.
-
Physics-of-Failure Based Handbook of Microelectronic Systems
By Shahrzad SalemiGuotao Wang, Steven Groothuis and Paul S. Ho, “Packaging Effect on Reliability for Cu/Low-k Structure”, ... “Impact of Junction Temperature on Microelectronics Device Reliability and Considerations for Space Applications”, ...
-
Electronic Failure Analysis Handbook: Techniques and Applications for Electronic and Electrical Packages, Components, and Assemblies
By Perry L. MartinOffering top-to-bottom coverage of this rapidly developing field; this book encompasses breakthrough techniques and technologies for both components and systems reliability testing; performance evaluation; and liability avoidance. --
-
Microelectronics Failure Analysis: Desk Reference
By EDFAS Desk Reference CommitteeChip Scale Package (CSP) is ideal for the applications of Cellular and Portable devices that require better use of real ... The challenges for performing failure analysis on CSPs, particularly for Multi-Chip Packages (MCP), at package ...
-
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis
-
Microelectronic Manufacturing Yield, Reliability, and Failure Analysis: 25-26 October 1995, Austin, Texas
By Society of Photo-optical Instrumentation Engineers, Gopal K. Rao, Massimo PiccoliMicroelectronic Manufacturing Yield, Reliability, and Failure Analysis: 25-26 October 1995, Austin, Texas
-
In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing
In-line Characterization, Yield Reliability, and Failure Analysis in Microelectronics Manufacturing
-
New Approaches to Image Processing based Failure Analysis of Nano-Scale ULSI Devices
By Zeev Zalevsky, Pavel Livshits, Eran GurThis book presents novel "smart" image processing methods, applications, and case studies concerning quality improvement of microscope images of microelectronic chips and process optimization.