How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions.
Pecht, M., Integrated Circuit, Hybrid, and Multichip Module Package Design Guideline, John Wiley & Sons, New York, NY, 1994. Puttlitz, J. K., “Preparation, Structure and Fracture Modes of Pb-Sn and Pb-In. Terminated ...
Glazer, J ., “Metallurgy of Low Temperature Pb-free Solder for Electronic Assembly," International Materials ... C., “Characterization of Lead-free Solders and Under Bump Metallurgies for F lip-Chip Package," IEEE Transactions on ...
Demonstrating the latest research and analysis in the area of through-life engineering services (TES), this book utilizes case studies and expert analysis from an international array of practitioners and researchers – who together ...
Tomczykowski, W.J.: A study on component obsolescence mitigation strategies and their impact on R&M, RAMS (2003) 6. Solomon, R., Sandborn, P., Pecht, M.: Electronic part life cycle concepts and obsolescence forecasting (2000) 7.
Location optimization of strategic alert sites for homeland defense. Omega, 39(2), 151–158. doi:10.1016/j.omega.2010.05.004 Berman, O., & Krass, D. (2002). The generalized maximal covering location problem. Computers & Operations ...
Supply Chain Management for Humanitarians. Kogan Page. Harmar, A. (2008). Integrated missions: A threat to humanitarian security? International Peacekeeping, 15(4), 528–539. doi:10.1080/13533310802239824 Heaslip, G. (2012).
The Writers Directory
This book explores the benefits of continuously improving the relationship between the firm, its suppliers, and its customers to ensure the highest added value.
Research Centers Directory has reported on the programs, facilities, publications, educational efforts and services of North America's leading nonprofit research institutes.