Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
This book shares the knowledge gained from the author's 15-year lead-free development leadership and her 25-year real-world SMT manufacturing experience.
Semmens, J. E., Martell, S.R., Kessler, L. W., (1995), Analysis of BGA and Other Area Array Packaging Using Acoustic Micro Imaging, ASME Pan Pacific Conference on Electronic Packaging. Shireman, M., (August 1984), “Enhancement of Wave ...
This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
S. Ganesan, M. Pecht, Lead-free electronics, CALCE EPSC Press, 2003. Y. Kariya, and M. Otsuka, Effect of Bismuth on the Isothermal Fatigue Properties of Sn-3.5 mass% Ag Alloy, Journal of Electronic Materials, Volume 27, Issue 7, ...
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection.
Ray , U . , I . Artaki , D . W . Finley , G . M . Wenger , T . Pan , H . D . Blair , J . M . Nicholson , and P . T ... Mei , Z . , F . Hua , and J . Glazer , " Sn - Bi - X Solders , " SMTA International , San Jose , CA , September 13 ...
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection.
Transactions, 2 (1971) 3067-3071. of thermodynamic database for micro-soldering alloys, Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd Conference, 2000, ...
causes premature failures of Pb-free flip-chip joints during their electromigration stressing. ... Glazer, J. (1994) Microstructure and mechanical properties of Pb-free solder alloys for lowcost electronic assembly: A review.
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection.