Through Silicon Vias: Materials, Models, Design, and Performance

Through Silicon Vias: Materials, Models, Design, and Performance
ISBN-10
131535179X
ISBN-13
9781315351797
Category
Science
Pages
216
Language
English
Published
2016-11-30
Publisher
CRC Press
Authors
Manoj Kumar Majumder, Brajesh Kumar Kaushik, Vobulapuram Ramesh Kumar

Description

Recent advances in semiconductor technology offer vertical interconnect access (via) that extend through silicon, popularly known as through silicon via (TSV). This book provides a comprehensive review of the theory behind TSVs while covering most recent advancements in materials, models and designs. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for Cu, carbon nanotube (CNT) and graphene nanoribbon (GNR) based TSVs are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR based TSVs are also discussed.

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