Designed for science and engineering students, this text focuses on emerging trends in processes for fabricating MEMS and NEMS devices. The book reviews different forms of lithography, subtractive material removal processes, and additive technologies. Both top-down and bottom-up fabrication processes are exhaustively covered and the merits of the d
Metrology and MEMS/NEMS Modeling Outline Diffraction limit (~λ) Superlens DNA object DNA image (a) (b) (c) From (a) ... Steven A. Edwards Introduction Metrology Tools to See and Size: Dimensional Metrology Tools to Measure Materials ...
C. Webber, “Automotive Sensor Market Trends,” presented at Sensors Marketing Conference, San Diego, 1999. Japanese-Federation, “Economic Impact of Micromachine Technology on the Creation of New Industries, 1998,” Japanese Micromachine ...
Manufacturing Techniques for Microfabrication and Nanotechnology
Microfabrication and Nanomanufacturing focuses on the technology of fabrication and manufacturing of engineering materials at these levels. The book provides an overview of techniques used in the semiconductor industry.
The book provides up-to-date information on a number of subjects of interest to engineers who are seeking more knowledge of how nano and micro devices are designed and fabricated.
Micromanufacturing Engineering and Technology presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or ...
Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems.
This book incorporates a selection of research and development papers. Its scope is the history and background, underlynig design methodology, application domains and recent developments.
Concerning sub-micron feature manufacture, the book explains: the philosophy of micro/ nanofabrication for integrated circuit industry; thin film deposition; (waveguide, plastic, semiconductor) material processing; packaging; interconnects; ...
... of Si versus SiO2 of over 150 ( 70 : 1 for resists ) , and aspect ratios of 30 : 1.15,16 Along this line , Chow et al . present a throughwafer electrical interconnect fabrication process compatible with standard CMOS processing .