Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection.
Semmens, J. E., Martell, S.R., Kessler, L. W., (1995), Analysis of BGA and Other Area Array Packaging Using Acoustic Micro Imaging, ASME Pan Pacific Conference on Electronic Packaging. Shireman, M., (August 1984), “Enhancement of Wave ...
This book shares the knowledge gained from the author's 15-year lead-free development leadership and her 25-year real-world SMT manufacturing experience.
J. Liang, D. Shangguan, and S. Downes, Effects of Load and Thermal Conditions on Lead-Free Solder Joint Reliability, ... Solder Joints Under Dynamic Mechanical Loading, International Journal of Microcircuits and Electronic Packaging, ...
Ray , U . , I . Artaki , D . W . Finley , G . M . Wenger , T . Pan , H . D . Blair , J . M . Nicholson , and P . T ... Mei , Z . , F . Hua , and J . Glazer , " Sn - Bi - X Solders , " SMTA International , San Jose , CA , September 13 ...
Harrison MR, Vincent JH, Steen HAH (2001) Lead-free reflow soldering for electronic assembly. ... Proceedings of IPACK'01 The Pacific Rim/ASME international electronic packaging technical conference and exhibition, Kauai, Hawaii, ...
Transactions, 2 (1971) 3067-3071. of thermodynamic database for micro-soldering alloys, Electronics Packaging Technology Conference, 2000. (EPTC 2000). Proceedings of 3rd Conference, 2000, ...
Edited by the founder of the New England Lead-Free Consortium and filled with over 130 detailed illustrations, Green Electronics Design and Manufacturing features: Guidance for lead-free conversions while maintaining quality and reliability ...
causes premature failures of Pb-free flip-chip joints during their electromigration stressing. ... Glazer, J. (1994) Microstructure and mechanical properties of Pb-free solder alloys for lowcost electronic assembly: A review.