Advanced MEMS Packaging
- ISBN-10
- 0071741836
- ISBN-13
- 9780071741835
- Category
- Microelectromechanical systems
- Pages
- 552
- Language
- English
- Published
- 2010
- Author
- John H. Lau
Description
Presenting cutting-edge techniques such as low-temperature C2W and W2W bonding and 3D packaging; this comprehensive guide helps you select reliable; creative; high-performance; robust; and cost-effective packaging techniques for MEMS ...
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