Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
- ISBN-10
- 1566778239
- ISBN-13
- 9781566778237
- Category
- Microelectromechanical systems
- Pages
- 656
- Language
- English
- Published
- 2010-10
- Publisher
- The Electrochemical Society
- Author
- C. Colinge
Description
Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.
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